Pinted Circuit Electronic PCB

Price: 1
Brand Name: HECPCB
Model Number: HECPCB-005A
Country/Region: China
Post Date: Nov 07,2011

Product Description: Pinted Circuit Electronic PCB

HECPCB CAPABILITY-High Volume Conventional PCBSurfaceGold platingHALOSPGold fingerRaw MaterialFR4, FR5(High TG), CEM-1, AI-base…Max. Board Size600mm*800mmMin. Board Size5mm*5mmWarp ageSingle-side<1.0%,Double-side<0.6%,Multilayer<0.6%Min. Thickness & Tolerance0.2mm+0.08mmMin. Line Width / Space & ToleranceHAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)Copper to Edge-board Spacing0.5mm (20mil)Hole side to Edge-board Spacing0.3mm (7.87mil)Min. Hole Size & ToleranceSize: 0.1mm/4mil(laser hole)Tolerance: +0.075mm/3mil for PTH Diameter;  +0.05mm/2mil for Non-PTH DiameterMin. Hole Space & Tolerance0.4mm+0.076mm (15.75mil+3mil)Hole Wall Thickness20-25um (0.79mil-1.0mil)Hole Position Deviation+0.076mm (+3mil)Min. Round Hole Dia.(for Punch)1.0mm(40mil) with PCB thickness <FR-4 1.0mm;1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)Min. Square Figure hole Dia.(for Punch)0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)Finished Board Size ToleranceCNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)V-cut Position Tolerance+0.2mm(+8mil)Base Material Thickness0.2-3.5mmBase Material Copper Thickness18um, 35um, 70umElectrolytic Flash Gold with thickness of 0.4 to 3.0 micro inchesAu: 0.01 to 0.076 micron; Ni: 5~15mmSelective Immersion Gold with thickness of 1 to 4 micro inchesAu: 0.025 to 0.1 micron; Ni: 2.54~5.5mmGold tab/finger plating with thickness of 5 to 30 micro inchesAu: 0.125 to 0.76 micron; Ni: 1.27~12mmElectroless Immersion Tin with thickness of 20 to 48 micro inches05 to 1.2 micronOrganic solder ability PreservativesEntek Cu 106A HT, Prefulx F2 LX HECPCB Factory overview- Equipment listCut Copper Foil MachineAuto.Flash Gold Plating Line(Cu/Ni/Au)and  line for (Cu/Sn)Cut Prepreg MachineScrubbing Machine (I. S)Scrubbing MachineAuto. Printing MachineAuto Cut Sheet LaminatorConveyor OvenExposerElectroless Nickel/Gold Plating LineDeveloper,Etching & Stripping MachineImmersion Tin Auto. LineBlack Oxide Line & OvenGold –Finger Plating LineAuto. Vacuum LaminatorHorizontal HAL MachineX-ray Trarget Hole Drilling MachinePunching MachineCNC Drilling Machine / Laser drilling machine (Japan)CNC Routing MachineProgrammerBevelling MachineRegistration DrillCNC V-cut MachineDrill SharpenerE-TesterAuto.Desmear & PTH LineFly Probe TesterAuto. Panel Plating LineOrganic Coating LineScrubbing Machine(IS)Auto.Film ProcessorDeveloperCAM Station(Orbotech Genesis 2000)  

Supplier Details:

HECPCB Electronic Co., Ltd.

Sales:Mr. Bin Chang

Contact Phone:86-0755-29177487

Main Products:Multilayer PCB

Business type:Manufacturer, Buying Office


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